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Congratulations to TPL member Bin Xie for ICEPT Outstanding Paper Award in the 18th International Conference on Electronic Packaging Technology
日期:2017-08-21 10:14:04  人气指数:  

Previous:Prof. Xiaobing Luo and TPL members attended 2017 National Congress of Heat and Mass Transfer in Suzhou (2017.10.27-2017.10.29)
Next: TPL members attended the 18th International Conference on Electronic Packaging Technology (ICEPT 2017) in Harbin, China (2017.08.16 - 2017.08.19)
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