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TPL devotes to improving packaging technologies for light emitting diodes (LEDs) and integrated circuits (IC). We are conducting the fundamental researches of heat transfer, fluid dynamics and optics design in LED/IC packaging.Inspired by the understanding of physics mechanisms in the LED/IC packaging, we are proposing some novel technologies for high-efficiency heat dissipation, high optical performance and ideal packaging processes. Currently, the micro-pump and some LED packaging components have been successfully designed and manufactured for the market.