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1. Book and Chapters

  1. Xiaobing Luo, Jingjing Zhang, Bin Xie, Spectra Design and Packaging Optimization for White Light-emitting Diodes with High Luminous Efficiency and Color Performance, Science Press, Beijing, Dec. 2017

  2. Sheng Liu, Xiaobing Luo, LED Packaging for Lighting Applications-Design, Manufacturing and Testing, John Wiley & Sons, USA, 2011

  3. Xiaobing Luo, Run Hu, Chip Packaging: Encapsulation of nitride LEDs, Chapter 15, Woodhead Publishing, UK, 2014

  4. Xiaobing Luo, Run Hu, Thermal management on LED packaging and applications, Chapter 9, Annual Review of Heat Transfer: 371-414, USA, 2015

2. Conference papers(*Corresponding author)

2014 Conference Papaers

  1. Jinyan Hu, Run Hu, and Xiaobing Luo*, Phase changed material based heat sinks and its geometry optimization for heat transfer enhancement, The Intersociety Conference on Thermal and Thermomechanical phenomena in Electronic Systems 2014 (ITHERM 2014), Orlando, Florida, USA, May 27 - May 30, pp. 876-881

  2. Run Hu, Jinyan Hu, and Xiaobing Luo*, Phosphor Temperature Reduction by Optimizing the Phosphor Configuration in White Light-emitting Diode Package, The Intersociety Conference on Thermal and Thermomechanical phenomena in Electronic Systems 2014 (ITHERM 2014), Orlando, Florida, USA, May 27 - May 30, pp. 182-185

  3. Bin Duan, Tinghui Guo, Mingqing Luo, and Xiaobing Luo*, A Mechanical Micropump for Electronic Cooling, The Intersociety Conference on Thermal and Thermomechanical phenomena in Electronic Systems 2014 (ITHERM 2014), Orlando, Florida, USA, May 27 - May 30, pp. 1038-1042

  4. Huai Zheng, Yiman Wang, Lan Li, and Xiaobing Luo*, Mechanism Investigation on Die Tilt in Die Attach Process Based on Minimal Free Energy Theory, The Intersociety Conference on Thermal and Thermomechanical phenomena in Electronic Systems 2014 (ITHERM 2014), Orlando, Florida, USA, May 27 - May 30, pp. 1251-1255

  5. Huai Zheng, Zhili Zhao, Yiman Wang, Lan Li, Sheng Liu, and xiaobing Luo*, Effect of Patterned Substrate on Light Extraction Efficiency of Chip-on-Board Packaging LEDs, The 64th Electronic Components and Technology Conference, Orlando, Florida, USA, May 27-May 30, 2014

  6. Qi Chen, Quan Chen, and Xiaobing Luo*, Fast Estimation of LED's Accelerated Lifetime By Online Test Method, The 64th Electronic Components and Technology Conference, Orlando, Florida, USA, May 27-May 30, 2014

2013 Conference Papers

  1. Run Hu, Zhiqiang Gan, and Xiaobing Luo*, Design of double freeform-surface lens by distributing the deviation angle for light-emitting diode uniform illumination, 14th International Conference on Electronic Packaging Technology & High Density Packaging, Dalian, China, pp. 1150-1153, 2013

  2. Run Hu, Yiman Wang, Xuebin Zhang, Liang Yang, and Xiaobing Luo*, Light extraction efficiency enhancement of white LEDs by bi-layer phosphor configuration, 14th International Conference on Electronic Packaging Technology & High Density Packaging, Dalian, China, pp. 214-216, 2013

  3. Xing Fu, and Xiaobing Luo*, Junction Temperature Estimation for Multiple Light Emitting Diodes Based on Surface Point Measurement, 14th International Conference on Electronic Packaging Technology (ICEPT 2013), Dalian, China, pp: 1142-1145, 2013

  4. Xing Fu, Zhangming Mao, and Xiaobing Luo*, System Packaging of Thousands Watt High Power LEDs with Heat Pipe-Fin Air Cooling System: Design and Manufacturing, 14th International Conference on Electronic Packaging Technology (ICEPT 2013), pp: 1146-1149, Dalian, China, 2013

  5. Bimrew Tamrat Admasu and Xiaobing Luo*, Effects of Thermal Contact Resistance and Thomson Heating on the Outputs of Solar Thermoelectric Power Generation System, 14th International Conference on Electronic Packaging Technology & High Density Packaging, Dalian, China, pp. 1260-1263, 2013

  6. Huai Zheng, Yiman Wang, Xing Fu, Sheng Liu, and Xiaobing Luo*, Conformal phosphor coating for phosphor-converted white LEDs on basis of dispensing process, 14th International Conference on Electronic Packaging Technology & High Density Packaging, Dalian, China, pp. 1138-1141, 2013

  7. Huai Zheng, Yiman Wang, Ling Xu, Sheng Liu and Xiaobing Luo*, Effect of die shape on die tilt in die attach process, 14th International Conference on Electronic Packaging Technology & High Density Packaging, Dalian, China, pp. 651-655, 2013

  8. Xiaobing Luo*, Zhangming Mao, Experimental Investigation on the Minichannel Cold Plate for High Temperature Uniformity Based on A Compact Thermal Model, 2013 11th International Conference on Nanochannel, Microchannel and Minichannels, Sapporo, Japan, 2013

  9. Run Hu, Tinghui Guo, Xiaolei Zhu, Sheng Liu, Xiaobing Luo*, A Small Flat-Plate Vapor Chamber Fabricated by Copper Powder Sintering and Diffusion Bonding for Cooling Electronic Packages, The 63th Electronic Components and Technology Conference, Las Vegas, NV, USA, 2013.

2012 Conference Papers

  1. Huai Zheng, Xing Fu, Bulong Wu, Sheng Liu, and Xiaobing Luo*, A method for geometry control of phosphor layer in high-power white LEDs by package structure, IEEE International Conference on Electronics Materials and Packaging ,pp. 246-250, 2012, Hong Kong.

  2. Fu’an Li, Xingguo Cheng ,Sheng Liu and Xiaobing Luo*,Air Gap Design of Current Sensor Based on Closed Loop Hall Effect, IEEE International Conference on Electronics Materials And Packaging pp. 37-40, 2012, Hong Kong.

  3. Run Hu, Chiyu Xie, and Xiaobing Luo*, A Method to Extend One-Dimensional Thermal Resistance Concept to Arbitrary Dimension, International Symposium on Transport Phenomena, Auckland, New Zealand, 283,PP:1-5, Nov. 19-22, 2012.

  4. Tinghui Guo, Yong Zou, and Xiaobing Luo*, A kind of micro mechanical pump for micro cooling system, International Symposium on Transport Phenomena, Auckland, New Zealand, 281, PP:1-5, Nov. 19-22, 2012.

  5. Jinlong Ma, Xing Fu, Run Hu, and Xiaobing Luo*, Effect of inclination angle on the performance of flat-plate vapor chamber, International Symposium on Transport Phenomena, Auckland, New Zealand, 282, PP:1-4, Nov. 19-22, 2012.

  6. Run Hu, Zhili Zhao, Sheng Liu, and Xiaobing Luo*, Robustness of Point Light Source Approximation in Lens Design for Light-Emitting Diode Packages,13th International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, China, 2012, PP:1455-1458.

  7. Run Hu, Huai Zheng, Chuangang Ji, Sheng Liu, Xiaobing Luo*, A Method to Design Freeform Lens for Uniform Illumination in Direct-Lit LED Backlight with High Distance-Height Ratio, 13th International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, China, 2012, PP:1474-1478.

  8. Xing Fu, Huai Zheng, Sheng Liu and Xiaobing Luo*, Optical Study of Phosphor Converted Light Emitting Diodes with Given Correlated Color Temperatures, 13th International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, China, 2012, PP:1479-1482.

  9. Huai Zheng, Xing Fu, Run Hu, Sheng Liu and Xiaobing Luo*, Angular Color Uniformity Improvement for Phosphor-converted White Light-Emitting Diodes by Optimizing Remote Coating Phosphor Geometry, 13th International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, China, 2012, PP:1483-1486.

  10. Fu’an Li, Xiaobing Luo*, Xingguo Chen, and Sheng Liu, Impact of the Winding Area of Enameled Wire on Packaging Performance of a Closed Loop Hall Effect Current Sensor, The 62th Electronic Components and Technology Conference, San Diego, CA, USA, May 29-June 2, 2012. pp: 1631-1635

  11. Run Hu, Zhangming Mao, Huai Zheng, Quan Chen, Sheng Liu and Xiaobing Luo*, A Compact Thermal Model to Predict the Junction Temperature of High Power Light Emitting Diode Package, The 62th Electronic Components and Technology Conference, San Diego, CA, USA, May 29-June 2, 2012. pp: 1781-1785

2011 Conference Papers

  1. Zhimin Wan, Ling Xu, Yang Zhang, Xiaobing Luo*, Mingxiang Chen, Junjie Chen, and Sheng Liu, Thermal Analysis and Improvement of High Power Electronic Packages, 12th International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, 2011, PP:27-31 (Cisco Best Student Paper Award)

  2. Zhimin Wan, Xiaobing Luo*, and Sheng Liu, Thermal Stress Analysis of PBGA under Natural Convection Using A Fluid-solid Coupling Method, 12th International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, 2011, PP:589-595

  3. Xiaobing Luo*, Han Feng, Jv Liu, Ming Lu Liu and Sheng Liu, An Experimental Investigation on Thermal Contact Resistance Across Metal Contact Interfaces, 12th International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, 2011, PP:733-738

  4. Quan Chen, Xiaobing Luo*, Run Chen, Sang Wang, Zhaohui Chen, Sheng Liu, Junction Temperature Study During Degradation Process of High Power Light-Emitting Diodes, 12th International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, 2011, PP:924-927

  5. Bulong Wu, Xiaobing Luo*, Zhili Zhao and Sheng Liu, Effect Investigation of Delamination on Optical Output of High Power LEDs, 12th International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, 2011, PP:1072-1076

  6. Huai Zheng, Jinlong Ma, Xiaobing Luo* and Sheng Liu, Precise Model of Phosphor Geometry Formed in Dispensing Process of LED Packaging, 12th International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, 2011, PP:1077-1080

  7. Run Hu, Xiaobing Luo*, and Sheng Liu, Effect of the Amount of Phosphor Silicone Gel on Optical Property of White Light-emitting Diodes Packaging, 12th International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, 2011, PP:1081-1084

  8. Zhangming Mao, Xiaobing Luo*, Sheng Liu, Compact Thermal Model for Microchannel Substrate with High Temperature Uniformity Subjected to Multiple Heat Sources, The 61th Electronic Components and Technology Conference, Orlando, Florida, USA, May 31-June 3, 2011. pp: 1662-1672

  9. Zhimin Wan, Xiaobing Luo*, and Sheng Liu, Effect of Blind Hole Depth and Shape of Solder Joint on the Reliability of Through Silicon Via (TSV), The 61th Electronic Components and Technology Conference, Orlando, Florida, USA, May 31-June 3, 2011. pp: 1657-1661

2010 Conference Papers

  1. Xiaobing Luo*, Zhangming Mao, Sheng Liu, Thermal Design of a 16W LED Bulb Based on Thermal Analysis of a 4W LED Bulb, The 60th Electronic Components and Technology Conference, Las Vegas, NV, USA, June 1-June 4, 2010. pp: 1906-1911

  2. Xiaobing Luo*, Run Hu, Tinghui Guo, Xiaolei Zhu, Wen Chen, Zhangming Mao, and Sheng Liu, Low Thermal Resistance LED Light Source with Vapor Chamber Coupled Fin Heat Sink, The 60th Electronic Components and Technology Conference, Las Vegas, NV, USA, June 1-June 4, 2010. pp: 1347-1352

  3. Bulong Wu, Xiaobing Luo*, Sheng Liu, Effect Mechanism of Moisture Diffusion on LED Reliability, Electronics System Integration Technology Conference, Berlin, Germany. 2010, 5642833

  4. Ju Liu, Han Feng, Xiaobing Luo*, Run Hu, Sheng Liu, A Simple Setup to Test Thermal Contact Resistance Between Interfaces of Two Contacted Solid Materials, 11th International Conference on Electronic Packaging Technology & High Density Packaging, 2010, PP:116-120

  5. Zhangming Mao, Xiaobing Luo*, Janghui Yang, Sheng Liu, Moisture Diffusivity Analysis of Polycarbonate for LED Lens, 11th International Conference on Electronic Packaging Technology & High Density Packaging, 2010, PP:1080-1087

  6. Zhimin Wan, Xiaobing Luo*, and Sheng Liu, Thermal Stress Analysis of PBGA Using A Fluid-Solid Coupling Method under Steady Convective Heat Transfer, 11th International Conference on Electronic Packaging Technology & High Density Packaging, 2010, PP:525-529 (Outstanding Paper Award)

Before 2010 Conference Papers

  1. Xiaobing Luo*, Zhangming Mao, Sheng Liu, A Thermal Model for Calculating Thermal Resistance of Eccentric Heat Source on Rectangular Plate with Convective Cooling Existing at Upper and Lower Surfaces, 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009), 2009. pp:294-298

  2. Xiaobing Luo*, Wei Xiong, Ting Cheng, Sheng Liu, Design and optimization of horizontally-located plate fin heat sink for high power LED street lamp, The 59th Electronic Components and Technology Conference, San Diego, CA, USA, May26-May29, 2009. pp: 854-859

  3. Y. L. Liu, X. B. Luo* and W. Liu, Cooling behavior in a novel heat sink based on multilayer staggered honeycomb structure, Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009, V3, p 131-135, 2009

  4. Y. L. Liu, X. B. Luo* and W. Liu, “Experimental study on a honeycomb micro channel cooling system”, in: Proceedings of the ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, June 22-24, 2009, Pohang, South Korea. pp:267-272

  5. Ting Cheng, Xiaobing Luo*, Suyi Huang, Sheng Liu, Thermal analysis and optimization of multi-chip LED packaging based on an analytical general solution, 59th ECTC,San Diego, California, USA, May 26-May 29, 2009, pp:1988-1993

  6. X. B. Luo*, W. Xiong, S. Liu, A Simpified Thermal resistance network model for high power LED street lamp, 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), 2008. pp:216-222 (NXP Best Paper Award)

  7. X. B. Luo, S. Liu, A closed micro jet cooling system for high power LEDs, 7th International Conference on Electronic Packaging Technology, p592-598, August, 2006. (Philips Best Paper Award)