NEWS HIGHLIGHTSYour current location: Home > NEWS HIGHLIGHTS > 正文


TPL members attended the 18th International Conference on Electronic Packaging Technology (ICEPT 2017) in Harbin, China (2017.08.16 - 2017.08.19)
日期:2017-08-21 10:14:04  人气指数:  

Previous: Congratulations to TPL member Bin Xie for ICEPT Outstanding Paper Award in the 18th International Conference on Electronic Packaging Technology
Next: Prof. Ranganathan Kumar from University of Central Florida visited TPL on 2017-07-10.
Return】【Close
9