2022年4月21日,收到国际电子封装技术会议(Electronics Packaging Technology Conference)组委会通知,彭嘉乐同学2020年在该会议上的报告论文“Thermal Management of the High power Electronics in High Temperature Downhole Environment”获得第22届国际电子封装技术会议(22nd Electronics Packaging Technology Conference)最佳学生论文奖(Best Student Paper Award)。
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